Low Melting Point Solder - List of Manufacturers, Suppliers, Companies and Products

McDermid Low Melting Point Solder HRL1-OM550 SDGs

Introducing examples of achieving energy savings and cost reduction with low melting point solder! Contributing to carbon neutrality by reducing CO2 emissions! Impact resistance equivalent to SAC305!

HRL1 OM-550 is a low-melting-point solder paste designed to improve yield and reduce component warpage. It significantly enhances drop impact resistance and thermal cycling resistance compared to the company's conventional products. Its melting point is considerably lower than that of SAC305, achieving energy savings in the assembly process by lowering the peak reflow temperature from 245°C to 185°C. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low-melting-point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The thermal cycling test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low-melting-point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low-melting-point solder.

Company：セイワ東京本社、関西支社、名古屋営業所、中国無錫　　グループ会社　エレクトロン（長野県松本市）
Price：Other

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【Special Purpose Example】Low Melting Point Solder

We will introduce the applications of low melting point solder.

Applications of Low Melting Point Solder Low melting point solder is used for the assembly of heat-sensitive components such as camera modules. Until now, these components have been retrofitted using resin-based solder, but further efforts are being made to lower temperatures and automate processes through the use of low-temperature solder and laser heating. Challenges of Low Melting Point Soldering Low melting point solder requires dedicated flux that matches its melting point, so it cannot be directly applied to what is currently in use. Additionally, since the alloy contains bismuth, caution is needed when using it in areas that require high reliability, such as automotive parts, medical devices, and industrial equipment. Ishikawa Metal's Low Melting Point Solder We already offer a variety of syringe-type solder pastes with proven market performance, including halogen-free syringe-type solder paste, so please contact us for more information. *For more details, feel free to contact us.*

Company：石川金属
Price：Other

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McDermid: Achieving a decarbonized society while reducing costs! Low melting point solder.

Introducing examples of achieving energy savings and cost reduction with solder paste! Contributing to carbon neutrality through CO2 reduction! Impact resistance equivalent to SAC305!

HRL1 OM-550 is designed to improve yield and reduce component warpage with a low melting point solder paste. It significantly enhances drop impact resistance and thermal cycle resistance compared to the company's conventional products, and its melting point is considerably lower than that of SAC305. By lowering the peak temperature during reflow from 245°C to 185°C, it achieves energy savings through reduced electricity costs in the assembly process. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low melting point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints has been significantly improved compared to the company's conventional low melting point solder. ● The thermal cycle test performance at the SAC series BGA ball joints has been significantly improved compared to the company's conventional low melting point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low melting point solder.